FPC-to-Wire Hybrid Transition Assembly

Product Overview

This hybrid changes from a flat FPC section to discrete or bundled wires at a controlled transition. Pad geometry, solder or crimp method, reinforcement and strain transfer at that junction determine the released construction.

Application Scenarios

• Compact devices, display modules, camera modules and internal board-to-board links
• Folded or thin routing spaces where cable height and bend path are constrained
• ZIF/LIF socket connections and FPC-to-wire transition projects
• Prototype and production programs that require stable dimensions and contact reliability

Custom Options

• Pitch, pin count, contact direction, length and reinforcement can be customized
• PI/FR4 stiffeners, adhesive, foam and EMI tape can be added per layout
• FFC, FPC and FPC-to-wire hybrid structures are available
• Sample validation can check socket fit, fold direction, bend radius and assembly interference

RFQ Inputs & Material Requirements

Provide the FPC artwork or tail drawing, wire-side connector BOM, circuit map, conductor and pad definitions, transition method, stiffener and encapsulation details, branch lengths, pull requirement and continuity test.